.svg){kind=logo}
TeraSi secures 13 MSEK funding to build next-gen wireless components and packaging
TeraSi, a Stockholm based tech-startup, has successfully raised 13 MSEK in a pre-seed funding round to accelerate the development of their revolutionary system-in-package technology. This breakthrough innovation addresses the crucial challenge of efficiently packaging high-frequency chips, enabling the realization of the next generation of wireless.
